21 May 2009 Roughness evolution of fused silica during plasma polishing processes
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Proceedings Volume 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 72822T (2009) https://doi.org/10.1117/12.831002
Event: AOMATT 2008 - 4th International Symposium on Advanced Optical Manufacturing, 2008, Chengdu, Chengdu, China
Abstract
Plasma polishing process finds important applications in the fabrication of super-smooth optical surfaces. It can be applied for the precise optical surface forming and to obtain optical surfaces with ultra-low roughness and without sub-surface damage (SSD). Published results show that the plasma polishing process is mainly used for the precise optical surface forming. Very limited results are reported in literatures on the process being used for the reducing of the optical surface roughness. A novel plasma polishing process has been developed in the Laboratory of Thin Film Techniques and Optical Test in Xi'an Technological University. In the process, highly stable SF6 and Ar plasmas are generated by using capacitive coupled hollow cathode (CCHC) RF discharge method. Factors that affect the stability of the plasma, such as gas flow rate, pressure and discharge power are systematically investigated. The polishing processes of fused silica have been studied using CCHC RF plasma. When the process parameters of the gas flow, pressure, and plasma powerare optimized, the roughness of the silica surface can be reduced from 1.2nm to 1.0nm in rms with minimized SSD.
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Weiguo Liu, Dasen Wang, Minda Hu, Yingnan Wang, Haifeng Liang, Lingxia Hang, "Roughness evolution of fused silica during plasma polishing processes", Proc. SPIE 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 72822T (21 May 2009); doi: 10.1117/12.831002; https://doi.org/10.1117/12.831002
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