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20 May 2009 Research on the measurement of thin film thickness based on phaseshift interferometry
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Abstract
Only by solving the problem of accurate measurement of thin film thickness, will it be possible to solve the problem of thin film preparation. A novel measurement method of thin film thickness based on phase-shift interferometry is presented in the paper. Taking advantage of Twyman-Green interferometer, the multi-frame interferogram measured the thin film can be obtained by receiving the interference fringes of thin film by means of CCD and using digital acquisition card to collect interferogram and with the help of computer control PZT driver and modulation piezoelectric regulator to promote reference mirror uniformly-spaced movement. After the gained interferogram were disposed of phase unwrapped, 3D wavefront containing the information of thin film thickness can be obtained. According to the characteristics between the thin film thickness and the unwrapping phase, taking advantage of the overlapping 4-frame average algorithm, corresponding relationships between the quantification phase information and thin film thickness of each point has been established to realize the thin film thickness accurate measurement. The results show that this method has the advantage of non-contact, the high accuracy, not only has testified the feasibility of film thickness measurement with phase-shift interferometry, but also has further ensured research and optimization of the thin film preparation technics. The PV and RMS value of the measured thin film thickness are 0.162μm and 0.043μm respectively.
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Yi-lei Shi, Jun-hong Su, Li-hong Yang, and Jun-qi Xu "Research on the measurement of thin film thickness based on phaseshift interferometry", Proc. SPIE 7283, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 728330 (20 May 2009); https://doi.org/10.1117/12.828754
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