As an important index, the characterization of nano-materials' topography is directly related with their competitive ability
in micro-mechanical or information industries in which surface roughness and film's thickness play significant roles. With
the developments of semiconducting materials and devices, the requirements for testing instruments are been changing
from low accuracy, high accuracy to broad measuring range. To satisfy higher demands, the optical profiler method was
introduced with different working principle which is briefly described in this paper. As real samples of nano-materials,
such as multilayer films, their surface roughness and thickness were measured. In summary, this technique has excellent
performance in its fast, non-contact, accurate and repeatable features.