In an optical-readout photomechanical imager, the infrared sensor array is physically separated from the ROIC. The
modularity of the optical readout architecture allows for extra design freedom that is not possible in bolometers, negating
fundamental trade-offs, such as NETD versus thermal time constant. For successful commercialization, the
photomechanical imager must meet application-specific performance and functional targets, and to this end, Agiltron has
advanced the photomechanical imaging platform over several technology generations. Improvements have been made to
both the optical readout system and the photomechanical sensor chip, which enabled reductions in size, weight, and
power (SWAP) and NETD over successive generations. The current-generation photomechanical imager has the size
equivalent to a digital camera and an /1-equivalent NETD and MDTD of less than 100 mK.