80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use

David Kryskowski; Justin Renken

doi:10.1117/12.819061

6 May 2009 80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use

David Kryskowski, Justin Renken

Proceedings Volume 7298, Infrared Technology and Applications XXXV; 72980N (2009) https://doi.org/10.1117/12.819061
Event: SPIE Defense, Security, and Sensing, 2009, Orlando, Florida, United States

Abstract

This paper presents an 80 x 60 element thermoelectric infrared focal plane array that provides high responsivity and a low cost/high volume potential. The device has been designed to have a responsivity of 2100 V/W. The overall chip size is 12.2mm x 9.3mm with a 10.4mm x 7.8mm imaging area. Each detector consists of three pairs of p-n polysilicon thermocouples with external dimensions of 130um x 130um and an internal resistance of 90k ohms. The thermal time constant for this device is ≈ 16ms. Compatible with standard CMOS processes this bulk micromachined focal plane array delivers near microbolometer performance making very low cost infrared cameras economically feasible.

Citation Download Citation

David Kryskowski and Justin Renken "80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980N (6 May 2009); https://doi.org/10.1117/12.819061

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