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6 May 2009 80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use
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Abstract
This paper presents an 80 x 60 element thermoelectric infrared focal plane array that provides high responsivity and a low cost/high volume potential. The device has been designed to have a responsivity of 2100 V/W. The overall chip size is 12.2mm x 9.3mm with a 10.4mm x 7.8mm imaging area. Each detector consists of three pairs of p-n polysilicon thermocouples with external dimensions of 130um x 130um and an internal resistance of 90k ohms. The thermal time constant for this device is ≈ 16ms. Compatible with standard CMOS processes this bulk micromachined focal plane array delivers near microbolometer performance making very low cost infrared cameras economically feasible.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Kryskowski and Justin Renken "80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980N (6 May 2009); https://doi.org/10.1117/12.819061
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