Translator Disclaimer
18 May 2009 Adhesive wafer bonding using photosensitive polymer layers
Author Affiliations +
Proceedings Volume 7362, Smart Sensors, Actuators, and MEMS IV; 73620E (2009) https://doi.org/10.1117/12.821725
Event: SPIE Europe Microtechnologies for the New Millennium, 2009, Dresden, Germany
Abstract
Adhesive wafer bonding is a technique that uses an intermediate layer for bonding (typically a polymer). The main advantages of using this approach are: low temperature processing (maximum temperatures below 400°C), surface planarization and tolerance to particles (the intermediate layer can incorporate particles with the diameter in the layer thickness range). Evaporated glass, polymers, spin-on glasses, resists and polyimides are some of the materials suitable for use as intermediate layers for bonding. The main properties of the dielectric materials required for a large field of versatile applications/designs can be summarized as: isotropic dielectric constants, good thermal stability, low CTE and Young's modulus, and a good adhesion to different substrates. This paper reports on wafer-to-wafer adhesive bonding using SINR polymer materials. Substrate coating process as well as wafer bonding process parameters optimization was studied. Wafer bonds exceeding the yield strength of the SINR polymer were accomplished on 150 mm Si wafers. Features of as low as 15 μm were successfully resolved and bonded. A unique megasonic-enhanced development process of the patterned film using low cost solvent was established and proven to exceed standard development method performance. Statistical analysis methods were used to show repeatability and reliability of coating processes.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Viorel Dragoi, Erkan Cakmak, Elliott Capsuto, Craig McEwen, and Eric Pabo "Adhesive wafer bonding using photosensitive polymer layers", Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73620E (18 May 2009); https://doi.org/10.1117/12.821725
PROCEEDINGS
9 PAGES


SHARE
Advertisement
Advertisement
Back to Top