25 August 2009 Experimental research on buckling of thin films in nano-scale under mechanical and thermal loading
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Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 73753B (2009) https://doi.org/10.1117/12.839250
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China
Abstract
In this paper, the mechanical and thermal properties of compressed thin film titanium films with 150nm thickness deposited on an organic glass substrate under mechanical and thermal loads were measured and characterized. In order to simulate the thin films in IT which subjected compound loads and to produce the buckle modes, the external uniaxial compression and thermal loading are subjected to the specimen by the symmetric loading device and the electrical resistance film in this experiment. The temperature of the thin film deposited on substrate was measured using thermoelectric couple. The range of temperature accords with the temperature range of the MEMS. It is found that the size and number of the delamination and buckling of the film are depended upon the pre-fixed mechanical loading. The transient conduction and thermal stability of the film and substrate was studied with finite element method.
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S. B. Wang, S. B. Wang, H. K. Jia, H. K. Jia, X. C. Ren, X. C. Ren, L. A. Li, L. A. Li, } "Experimental research on buckling of thin films in nano-scale under mechanical and thermal loading", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 73753B (25 August 2009); doi: 10.1117/12.839250; https://doi.org/10.1117/12.839250
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