Nondestructive testing of wood defects by ESSPI

Jie Lu; Guang ping Zou

doi:10.1117/12.839255

25 August 2009 Nondestructive testing of wood defects by ESSPI

Jie Lu, Guang ping Zou

Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 73753G (2009) https://doi.org/10.1117/12.839255
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China

Abstract

The aim of this work is to use non-destructive optical measurement techniques for defect detection. This paper presents the application of electronic shearography speckle pattern interferometry (ESSPI) to detect visible and invisible on the surface defects of a pine wood specimen The different artificial defects were created under the pine wood surface to simulate "defected" samples. The ESSPI set-up based on a He-Ne CW laser has been developed and used for studying the possible locations, sizes and shapes of wood defects. The results were real time and well agreed with the actual defects. Therefore the present method is feasible.

Citation Download Citation

Jie Lu and Guang ping Zou "Nondestructive testing of wood defects by ESSPI", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 73753G (25 August 2009); https://doi.org/10.1117/12.839255

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