25 August 2009 Nondestructive testing of wood defects by ESSPI
Author Affiliations +
Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 73753G (2009) https://doi.org/10.1117/12.839255
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China
Abstract
The aim of this work is to use non-destructive optical measurement techniques for defect detection. This paper presents the application of electronic shearography speckle pattern interferometry (ESSPI) to detect visible and invisible on the surface defects of a pine wood specimen The different artificial defects were created under the pine wood surface to simulate "defected" samples. The ESSPI set-up based on a He-Ne CW laser has been developed and used for studying the possible locations, sizes and shapes of wood defects. The results were real time and well agreed with the actual defects. Therefore the present method is feasible.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jie Lu, Jie Lu, Guang ping Zou, Guang ping Zou, } "Nondestructive testing of wood defects by ESSPI", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 73753G (25 August 2009); doi: 10.1117/12.839255; https://doi.org/10.1117/12.839255
PROCEEDINGS
6 PAGES


SHARE
Back to Top