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25 August 2009 Study of mechanical behavior of bimaterial interface by electronic speckle pattern interferometry (ESPI)
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Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 73754V (2009) https://doi.org/10.1117/12.839321
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China
Abstract
Interface is significant part in the structure of composite materials. However, crack and fracture are often happened in the interface and deprive the whole mechanical functions of composite materials. In order to obtain the fracture mechanism of materials with interface, different defect shape in interface and different layer ratio for metal-porcelain bimaterial are studied by electronic speckle pattern interferometry (ESPI). The experiment results indicate that the resisting fracture capacity for the specimen with vertical interface crack is quite weak. But the mechanical behavior of specimens with no defect in interface has sufficient capacity resisting fracture. Simultaneously, the process of experiment shows that ESPI is suitable for measuring small displacement.
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Honglin Mi, Ruhua Fang, Guobiao Yang, Qirong Zhu, and Peng Lu "Study of mechanical behavior of bimaterial interface by electronic speckle pattern interferometry (ESPI)", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 73754V (25 August 2009); https://doi.org/10.1117/12.839321
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