25 August 2009 High speed deformation measurement of electronic packages by the digital image correlation method
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Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 737558 (2009) https://doi.org/10.1117/12.839335
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China
Abstract
4-point dynamic bending tests of board level electronics packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data.
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Jiangang Li, Jiangang Li, Fei Qin, Fei Qin, Tong An, Tong An, Ling Jin, Ling Jin, } "High speed deformation measurement of electronic packages by the digital image correlation method", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 737558 (25 August 2009); doi: 10.1117/12.839335; https://doi.org/10.1117/12.839335
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