25 August 2009 SHPB tests for mechanical behavior of lead-free solder alloys
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Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 737568 (2009); doi: 10.1117/12.839371
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China
Abstract
Dynamic behavior of solder joints in microelectronic packages is key issue for drop/impact reliability design of mobile electronic products. The dynamic mechanical behavior of 63Sn37Pb, 96.5Sn3.5Ag and 96.5Sn3.0Ag0.5Cu at high strain rates have been investigated by using the split Hopkinson pressure/tension bar testing technique (SHPB). Stress-strain relations of the three solders were obtained at strain rates of 600s-1, 1200s-1 and 2200s-1, respectively. The experimental results show that the lead-free solders are strongly strain rate dependent. 96.5Sn3.5Ag is the most sensitive to strain rate, while 63Sn37Pb is the least. 96.5Sn3.0Ag0.5Cu has the greatest yield stress and tensile strength. Relations of the yield stress and the tensile strength of the solders with strain rate were fitted.
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Fei Qin, Tong An, Na Chen, "SHPB tests for mechanical behavior of lead-free solder alloys", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 737568 (25 August 2009); doi: 10.1117/12.839371; https://doi.org/10.1117/12.839371
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KEYWORDS
Protactinium

Electronics

Lead

Reliability

Microelectronics

Current controlled current source

Experimental mechanics

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