11 May 2009 Developing quartz wafer mold manufacturing process for patterned media
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Proceedings Volume 7379, Photomask and Next-Generation Lithography Mask Technology XVI; 73792Q (2009) https://doi.org/10.1117/12.824340
Event: Photomask and NGL Mask Technology XVI, 2009, Yokohama, Japan
Abstract
Recently, patterned media have gained attention as a possible candidate for use in the next generation of hard disk drives (HDD). Feature sizes on media are predicted to be 20-25 nm half pitch (hp) for discrete-track media in 2010. One method of fabricating such a fine pattern is by using a nanoimprint. The imprint mold for the patterned media is created from a 150-millimeter, rounded, quartz wafer. The purpose of the process introduced here was to construct a quartz wafer mold and to fabricate line and space (LS) patterns at 24 nmhp for DTM. Additionally, we attempted to achieve a dense hole (HOLE) pattern at 12.5 nmhp for BPM for use in 2012. The manufacturing process of molds for patterned media is almost the same as that for semiconductors, with the exception of the dry-etching process. A 150-millimeter quartz wafer was etched on a special tray made from carving a 6025 substrate, by using the photo-mask tool. We also optimized the quartz etching conditions. As a result, 24 nmhp LS and HOLE patterns were manufactured on the quartz wafer. In conclusion, the quartz wafer mold manufacturing process was established. It is suggested that the etching condition should be further optimized to achieve a higher resolution of HOLE patterns.
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Tsuyoshi Chiba, Tsuyoshi Chiba, Masaharu Fukuda, Masaharu Fukuda, Mikio Ishikawa, Mikio Ishikawa, Kimio Itoh, Kimio Itoh, Masaaki Kurihara, Masaaki Kurihara, Morihisa Hoga, Morihisa Hoga, } "Developing quartz wafer mold manufacturing process for patterned media", Proc. SPIE 7379, Photomask and Next-Generation Lithography Mask Technology XVI, 73792Q (11 May 2009); doi: 10.1117/12.824340; https://doi.org/10.1117/12.824340
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