24 August 2009 Research on packaging technology for a fiber optic acoustic sensor
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Proceedings Volume 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors; 73810U (2009) https://doi.org/10.1117/12.835680
Event: International Symposium on Photoelectronic Detection and Imaging 2009, 2009, Beijing, China
Abstract
A micro acoustic sensor with inclined fibers was proposed to improve its sensitivity. In order to get the highest sensitivity within the micro structure, the relative positions of elements in sensor should be exactly located; especially the distance between fibers and membrane should be optimum. A packaging technology for this micro sensor assemblage and test is introduced. It is based on a packaging system composed of three parts: distance adjusting, intensity collection and data analysis. The distance adjusting part increases the operating distance with a step of 2μm. Meanwhile the received power is recorded by intensity collection part on line to get the intensity characteristic curve. Through the data analysis part, sensitivity curve, optimum operating distance, the highest sensitivity and optimum received power of the proposed acoustic sensor are got. An experiment was implemented to assemble and test a sensor whose angle between two fibers was 60° by the proposed packaging system. Its optimum operating distance and highest sensitivity were analyzed to be 30μm and 2.49μW/μm. The sensitivity of packaged sensor to standard acoustic signal is 16mV/Pa and SNR is tested to be 54dB.
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Rui Li, Rui Li, Wen Xiao, Wen Xiao, Dong Yao, Dong Yao, Bingshi Xu, Bingshi Xu, Lin Cong, Lin Cong, } "Research on packaging technology for a fiber optic acoustic sensor", Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73810U (24 August 2009); doi: 10.1117/12.835680; https://doi.org/10.1117/12.835680
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