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5 August 2009 The optimizing designing of bi-material micro cantilever with adhesive layer in between and its application in an uncooled MEMS IR FPA
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Abstract
Bi-material cantilever is an important basic structure in MEMS device. Most of the materials with thermal property fit for bi-material are not adhering together steadily. An adhesive layer in between is needed. In this paper, based on the thermal stress and combined deformation in Mechanics of Materials, a model related to the physics properties, structure dimension, and the tilt angle caused by thermal stress is set up. A research of how to select the materials and how to determinate the thickness and other size of a bi-material cantilever is carry out by this model, further more, an optic read out IR image chip pixel is designed that shows this model is simple and practical.
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Xia Zhang, Bin-bin Jiao, Da-peng Chen, and Tian-chun Ye "The optimizing designing of bi-material micro cantilever with adhesive layer in between and its application in an uncooled MEMS IR FPA", Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 73834M (5 August 2009); https://doi.org/10.1117/12.836580
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