The thermal conductivity of alumina thin film for LED

Ming-Seng Hsu; Chung-Chih Chang; Hsiang-Hsi Cheng; Yueh Ouyang; Yau-Chyr Wang

doi:10.1117/12.825657

21 August 2009 The thermal conductivity of alumina thin film for LED

Ming-Seng Hsu, Chung-Chih Chang, Hsiang-Hsi Cheng, Yueh Ouyang, Yau-Chyr Wang

Proceedings Volume 7420, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications III; 742012 (2009) https://doi.org/10.1117/12.825657
Event: SPIE Photonic Devices + Applications, 2009, San Diego, California, United States

Abstract

Thermal management has the important influence in quantum effect of light emitting diodes (LED) based on printed circuit board (PCB). In the industrial processing, the quality of the thermal dissipation is decided by the gumming technique between the PCB and aluminum plate. Because it transfers the heat from electric device to the aluminum plate, which completely removes the heat. In this study, a superior method, alumina thin films, soldered the LED lamps to enhance the heat transfer. The films were fabricated onto 1070 aluminum alloy substrate by plasma spraying, vacuum sputtering and electric plating technologies. The dielectric coatings were characterized by several subsequent analyses, especially the measurement of thermal resistance. The X-Ray diffraction (XRD) diagram analysis reveals that alumina phases were successfully grown on the individual substrate. Compared to alumina coating fabricated by plasma spraying and electric plating technologies, vacuum sputtering creates low sheet resistivity, high hardness, high critical load, and good thermal conduction of 119 W/m-K.

Citation Download Citation

Ming-Seng Hsu, Chung-Chih Chang, Hsiang-Hsi Cheng, Yueh Ouyang, and Yau-Chyr Wang "The thermal conductivity of alumina thin film for LED", Proc. SPIE 7420, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications III, 742012 (21 August 2009); https://doi.org/10.1117/12.825657

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