22 August 2009 Cryogenic adhesive testing for the NIRCam optical bench assembly
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Proceedings Volume 7425, Optical Materials and Structures Technologies IV; 74250J (2009); doi: 10.1117/12.828262
Event: SPIE Optical Engineering + Applications, 2009, San Diego, California, United States
Abstract
The Near Infrared Camera (NIRCam) Optical Bench Assembly (OBA) is a I-220H beryllium adhesively-bonded structure designed to operate at 35K. To support design activities, an adhesive testing program was performed, with particular emphasis on adhesive allowables at 35K. The geometries of the samples were designed to emulate the structural features of the OBA. The testing program is described, test data presented, and the results applied to the NIRCam OBA.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael Jacoby, Alison Nordt, Bryan Hurlbut, "Cryogenic adhesive testing for the NIRCam optical bench assembly", Proc. SPIE 7425, Optical Materials and Structures Technologies IV, 74250J (22 August 2009); doi: 10.1117/12.828262; https://doi.org/10.1117/12.828262
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KEYWORDS
Adhesives

Cryogenics

Beryllium

Optical benches

Optical fabrication

Failure analysis

Finite element methods

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