27 May 2009 Improving yield and cycle time at the inspection process by means of a new defects disposition technique
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Proceedings Volume 7470, 25th European Mask and Lithography Conference; 74700T (2009) https://doi.org/10.1117/12.835191
Event: 25th European Mask and Lithography Conference, 2009, Dresden, Germany
Abstract
The paper describes a new approach of evaluating isolated opaque defects, as well as CD-like defects on hole layer, using features available on the inspection tool. This eliminates further verifications on specific tools, which would result in their overloading and in time consuming, with a potential negative impact on the delivery time of any product going through such processes. In the first case the method consists of associating the effect of a cluster of assist bars to that of isolated opaque defects, considering their size and position on the layout of the mask. In case of CD-like defects on holes the evaluation is based on a thorough characterization of the performance of the Litho2 detector of the Terascan T576 and its further verification with the AIMS readings.
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Ernesto Villa, Ernesto Villa, Luca Sartelli, Luca Sartelli, Hiroyuki Miyashita, Hiroyuki Miyashita, Frank Sundermann, Frank Sundermann, Stuart Gough, Stuart Gough, Felix Dufaye, Felix Dufaye, Astrid Sippel, Astrid Sippel, "Improving yield and cycle time at the inspection process by means of a new defects disposition technique", Proc. SPIE 7470, 25th European Mask and Lithography Conference, 74700T (27 May 2009); doi: 10.1117/12.835191; https://doi.org/10.1117/12.835191
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