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27 May 2009 Nuisance event reduction using sensitivity control layers (SCL) for advanced photomask inspection
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Proceedings Volume 7470, 25th European Mask and Lithography Conference; 74700U (2009) https://doi.org/10.1117/12.835192
Event: 25th European Mask and Lithography Conference, 2009, Dresden, Germany
Abstract
Conventional photomask inspection techniques utilize global sensitivity for all inspected area in the die; SRAF and OPC features become the sensitivity-limiters for advanced photomasks which can result in reduced sensitivity to defects of interest (DOI). We describe the implementation of Sensitivity Control Layer (SCL), a novel database inspection methodology for the KLA-Tencor TerascanHR platform to improve sensitivity and reduce nuisance detections. This methodology enables inspection at maximum sensitivity in critical die-areas via "layer definition" and reducing sensitivity to sub-resolution features during inspection which can dramatically improve false-rate. DRAM and FLASH inspection performance was improved through the use of up to 6-control layers to increase sensitivity in the active area while reducing false detections by as much as 100X. Post-inspection defect analysis, and improved disposition accuracy of the SCL-enabled inspections will also benefit cycle time and higher throughput. In all test cases, sensitivity parameters were increased in the regions of interest over baseline inspections run with typical, production-type inspection methodologies. SCL inspection-sensitivity management, and layer partitioning of OPC structures, SRAF's, and other sub-resolution features is discussed in detail.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shad Hedges, Chin Le, Mark Eickhoff, Mark Wylie, Tim Simmons, Venugopal Vellanki, and Jeff McMurran "Nuisance event reduction using sensitivity control layers (SCL) for advanced photomask inspection", Proc. SPIE 7470, 25th European Mask and Lithography Conference, 74700U (27 May 2009); https://doi.org/10.1117/12.835192
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