27 May 2009 High speed (>100 Gbps) key components for a scalable optical data link to be implemented in future maskless lithography applications
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Proceedings Volume 7470, 25th European Mask and Lithography Conference; 747011 (2009) https://doi.org/10.1117/12.835200
Event: 25th European Mask and Lithography Conference, 2009, Dresden, Germany
Abstract
Maskless lithography based on electron beam parallelization requires well adapted data links, capable of transmitting the corresponding data volume at rates up to the Tbps domain. In this paper we focus on two key components, the high-speed data buffer unit and the integrated optical receiver, which are part of a scalable (24 - 140 Gbps) optical data link. The high-speed buffer design architecture enables the transmission of skew-compensated parallel data in the range of 50 Gbps. The 45-channel low-noise integrated optical receiver chip based on BiCMOS 0.6 micron technology is capable of an overall transmission capacity of 140 Gbps.
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A. Paraskevopoulos, A. Paraskevopoulos, S.-H. Voss, S.-H. Voss, M. Talmi, M. Talmi, G. Walf, G. Walf, } "High speed (>100 Gbps) key components for a scalable optical data link to be implemented in future maskless lithography applications", Proc. SPIE 7470, 25th European Mask and Lithography Conference, 747011 (27 May 2009); doi: 10.1117/12.835200; https://doi.org/10.1117/12.835200
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