20 October 2009 Thermoset shape-memory polymer nanocomposite filled with nanocarbon powders
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Proceedings Volume 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering; 74934O (2009) https://doi.org/10.1117/12.845438
Event: Second International Conference on Smart Materials and Nanotechnology in Engineering, 2009, Weihai, China
Abstract
A system of a thermoset styrene-based shape-memory polymer (SMP) filled with nanocarbon powders is investigated in this paper. The thermomechanical properties are characterized by thermal gravity analysis, differential scanning calorimetery and dynamic mechanical analysis. In addition, the distribution of CB is investigated by scanning electron microscope. To realize the electroactive stimuli of SMP, the electrical conductivity of SMP filled with various amounts of CB is characterized. The percolation threshold of electrically conductive SMP filled with CB is about 3.8 % (volume fraction of CB), which is much lower than many other electrically conductive polymers. When applying a voltage of 30V, the shape recovery process of SMP/CB (10 vol%) can be realized in about 100s.
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Xin Lan, Yanju Liu, Jinsong Leng, "Thermoset shape-memory polymer nanocomposite filled with nanocarbon powders", Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 74934O (20 October 2009); doi: 10.1117/12.845438; https://doi.org/10.1117/12.845438
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