Analysis of packaging material impacting on FBG temperature sensors

Wen-hua Wang; Si-dong Li; Jun-xiu Lin

doi:10.1117/12.837814

23 November 2009 Analysis of packaging material impacting on FBG temperature sensors

Wen-hua Wang, Si-dong Li, Jun-xiu Lin

Proceedings Volume 7508, 2009 International Conference on Optical Instruments and Technology: Advanced Sensor Technologies and Applications; 750810 (2009) https://doi.org/10.1117/12.837814
Event: International Conference on Optical Instrumentation and Technology, 2009, Shanghai, China

Abstract

In this paper, to investigate a method improving high temperature response characteristics, the high temperature sensing properties of fiber Bragg gratings packaged by the red copper and cuprum and aluminum respectively were studied. The results indicate that the response characteristics of FBG have very good linearity, and the linearity of FBG packaged by aluminum is best, but its response time is slower because of lower heat conductivity of packing material, and that higher thermal expansion coefficient of packaging base material can effectively reduce the nonlinearity of FBG sensor in high temperature environment. At last, a method improving the temperature sensitivity of FBG sensor and reducing FBG's nonlinear response versus temperature was presented, and packaging material is selected according to response time versus temperature change.

Citation Download Citation

Wen-hua Wang, Si-dong Li, and Jun-xiu Lin "Analysis of packaging material impacting on FBG temperature sensors", Proc. SPIE 7508, 2009 International Conference on Optical Instruments and Technology: Advanced Sensor Technologies and Applications, 750810 (23 November 2009); https://doi.org/10.1117/12.837814

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