Analysis and modeling of thermal failure based on a MEMS thermally driven structure

Xiuhan Li; Quan Yuan; Leijie Lang; Jian Liu; Yu Liu; Dongming Fang; Haixia Zhang

doi:10.1117/12.845904

20 November 2009 Analysis and modeling of thermal failure based on a MEMS thermally driven structure

Xiuhan Li, Quan Yuan, Leijie Lang, Jian Liu, Yu Liu, Dongming Fang, Haixia Zhang

Proceedings Volume 7510, 2009 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications; 75100L (2009) https://doi.org/10.1117/12.845904
Event: International Conference on Optical Instrumentation and Technology, 2009, Shanghai, China

Abstract

This paper presents an analysis of the thermal failure model of a MEMS thermal driven structure fabricated by MetalMump process. The finite element analysis was used to study the thermal electrical model and the experimental test results were compared with the simulated results. The parameters of the driven current applied on the structure which influence the system stability were considered, including the current value as well as the frequency. Avoiding thermal aggregation leading to structure destruction, the geometry factors of the structure design were also discussed to improve the heat conduction effect.

Citation Download Citation

Xiuhan Li, Quan Yuan, Leijie Lang, Jian Liu, Yu Liu, Dongming Fang, and Haixia Zhang "Analysis and modeling of thermal failure based on a MEMS thermally driven structure", Proc. SPIE 7510, 2009 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications, 75100L (20 November 2009); https://doi.org/10.1117/12.845904

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KEYWORDS

Thermal modeling

Microelectromechanical systems

Failure analysis

Nickel

Switches

Silicon

Finite element methods

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