20 November 2009 Analysis and modeling of thermal failure based on a MEMS thermally driven structure
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Proceedings Volume 7510, 2009 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications; 75100L (2009) https://doi.org/10.1117/12.845904
Event: International Conference on Optical Instrumentation and Technology, 2009, Shanghai, China
Abstract
This paper presents an analysis of the thermal failure model of a MEMS thermal driven structure fabricated by MetalMump process. The finite element analysis was used to study the thermal electrical model and the experimental test results were compared with the simulated results. The parameters of the driven current applied on the structure which influence the system stability were considered, including the current value as well as the frequency. Avoiding thermal aggregation leading to structure destruction, the geometry factors of the structure design were also discussed to improve the heat conduction effect.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiuhan Li, Xiuhan Li, Quan Yuan, Quan Yuan, Leijie Lang, Leijie Lang, Jian Liu, Jian Liu, Yu Liu, Yu Liu, Dongming Fang, Dongming Fang, Haixia Zhang, Haixia Zhang, } "Analysis and modeling of thermal failure based on a MEMS thermally driven structure", Proc. SPIE 7510, 2009 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications, 75100L (20 November 2009); doi: 10.1117/12.845904; https://doi.org/10.1117/12.845904
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