Design and simulation of comparative method for testing transverse thermal conductivity of Si[sub]x[/sub]N[sub]y[/sub] thin film

Lixia Yang; Zhiming Wu; Kai Yuan; Yadong Jiang

doi:10.1117/12.837586

20 November 2009 Design and simulation of comparative method for testing transverse thermal conductivity of Si_xN_y thin film

Lixia Yang, Zhiming Wu, Kai Yuan, Yadong Jiang

Author Affiliations +

Proceedings Volume 7511, 2009 International Conference on Optical Instruments and Technology: Optoelectronic Measurement Technology and Systems; 751114 (2009) https://doi.org/10.1117/12.837586
Event: International Conference on Optical Instrumentation and Technology, 2009, Shanghai, China

Abstract

A new structure of Si_xN_y thin film transverse thermal conductivity measuring by comparative method is introduced. And by using finite element software ANSYS we emulated the effect to thermal distribution by the factors of heatpower, length & width of suspending beam, and the thermal conductivity. This method, with no limitation of measuring in vacuum, is simply structured and easily operated.

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Lixia Yang, Zhiming Wu, Kai Yuan, and Yadong Jiang "Design and simulation of comparative method for testing transverse thermal conductivity of Si_xN_y thin film", Proc. SPIE 7511, 2009 International Conference on Optical Instruments and Technology: Optoelectronic Measurement Technology and Systems, 751114 (20 November 2009); https://doi.org/10.1117/12.837586

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