26 October 2009 Thin films' thickness uniformity associated with the method of electron beam evaporation
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Abstract
Coating material has been considered as being made up of a lot of small tablets. These tablets have plane surface during the whole film preparation process. Based on the assumption that a column etching pit will form in coating material when electron beam is used for heating, influences of the etching pit's dimension and the internal structure of the vacuum chamber on films thickness uniformity have been investigated. Results reflect that the appearance of etching pit does not always cause negative influence on films thickness uniformity. The negative impact of etching on films thickness uniformity can be reduced by optimizing the internal structure of the vacuum chamber and preparation technical parameters. But, it is difficult to achieve the beneficial action. This investigation is useful to help us understand physical meaning of the emission characteristics of the evaporation particle and design experimental scheme.
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Zhilin Xia, Zhilin Xia, Yiyu Xue, Yiyu Xue, Peitao Guo, Peitao Guo, Zhangwang Li, Zhangwang Li, } "Thin films' thickness uniformity associated with the method of electron beam evaporation", Proc. SPIE 7516, Photonics and Optoelectronics Meetings (POEM) 2009: Optoelectronic Devices and Integration, 75160V (26 October 2009); doi: 10.1117/12.839152; https://doi.org/10.1117/12.839152
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