Translator Disclaimer
14 April 2010 Effect of error in crack tip identification on the photoelastic evaluation of SIFs of interface cracks
Author Affiliations +
Proceedings Volume 7522, Fourth International Conference on Experimental Mechanics; 75220D (2010) https://doi.org/10.1117/12.852519
Event: Fourth International Conference on Experimental Mechanics, 2009, Singapore, Singapore
Abstract
Digital photoelastic evaluation of stress intensity factors (SIFs) of bimaterial interface cracks using the method of least squares and the multi-parameter stress field equations is of current interest. For this, positional coordinates (with crack tip as origin) and corresponding fringe orders of data points are collected along isochromatic fringe contours in such a way that the geometric features of the fringe field are captured. Whole-field evaluation of isochromatic parameter is now made possible by various techniques of digital photoelasticity, enabling automation of the data collection procedure and collection of data points along fractional fringe orders as well. However, the identification of the crack tip, still done interactively, is prone to error. When the crack tip location is inaccurately identified, the evaluated SIFs are considerably different. The effect of error in precise identification of the crack tip on the evaluated SIFs is analyzed with the help of theoretically simulated fringe fields, in order to arrive at a technique by which the crack tip could be detected in a semiautomated fashion reducing this error in the evaluated SIFs.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. Neethi Simon and K Ramesh "Effect of error in crack tip identification on the photoelastic evaluation of SIFs of interface cracks", Proc. SPIE 7522, Fourth International Conference on Experimental Mechanics, 75220D (14 April 2010); https://doi.org/10.1117/12.852519
PROCEEDINGS
8 PAGES


SHARE
Advertisement
Advertisement
Back to Top