28 December 2010 An AOI approach for IC lead index auto-verification
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Proceedings Volume 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation; 754470 (2010) https://doi.org/10.1117/12.886015
Event: Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 2010, Hangzhou, China
Abstract
To wire-bond automatically, the IC lead positions on the CAD drawing and the corresponding ones on the extracted substrate image should be pre-verified. This paper proposed an AOI approach for IC lead index auto-verification which conquered the lead shape distortion, golden exposed, shifting, rotation, and scaling difficulties of extracted substrate image. Experimentations revealed that the proposed AOI approach can accurately verify the corresponding leads between a CAD drawing and the extracted substrate image with high repeatability.
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Der-Baau Perng, Der-Baau Perng, Guei-Ci Chang, Guei-Ci Chang, Shu-Ming Lee, Shu-Ming Lee, Ssu-Han Chen, Ssu-Han Chen, } "An AOI approach for IC lead index auto-verification", Proc. SPIE 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 754470 (28 December 2010); doi: 10.1117/12.886015; https://doi.org/10.1117/12.886015
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