17 February 2010 355nm DPSS UV laser micro-processing for the semiconductor and electronics industry
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Abstract
During the last decade, diode-pumped solid state (DPSS) lasers have been gained wider application in semiconductor and electronics industry due to the advantages of high efficiency, low operating cost, good beam quality and flexibility as well as miniature size. Now, 355nm DPSS UV laser has increasingly been adopted in micro-processing application for both semiconductor and electronics industry where both micro-processing quality and precision of high-density, multilayer and multi-material components are in a strong demand. Our works on typical applications of 355nm DPSS UV laser micro-processing both semiconducting and electronic materials have been introduced in this paper, including drilling (200μm blind holes in 4-layer FPC), cutting (coverlay, CCL, FPC, 0.6mm silicon), and etching (ITO-glass). The effects of the processing parameters (pulse energy, frequency, peak power, scanning speed and focal plane position as well as processing modes) on the micro-processing quality and precision have been investigated and analyzed. By optimizing the processing parameters, the blind drilling depth to the second copper layer can be controlled accurately and the roughness Sq 1.33μm on the second copper surface can be achieved. A high quality and size precision (position precision 20μm) cutting edge without charring, burrs and micro-cracks as well as with very small heat affected zone (HAZ) can be also obtained. When etching function film, the etching width is less than 20 micron, and the etching speed is more than 500mm/s.
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Fei Zhang, Jun Duan, XiaoYan Zeng, XiangYou Li, "355nm DPSS UV laser micro-processing for the semiconductor and electronics industry", Proc. SPIE 7584, Laser Applications in Microelectronic and Optoelectronic Manufacturing XV, 75840Z (17 February 2010); doi: 10.1117/12.845689; https://doi.org/10.1117/12.845689
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