Submicron accuracy optimization for laser beam soldering processes

Erik Beckert; Thomas Burkhardt; Marcel Hornaff; Andreas Kamm; Ingo Scheidig; Cornelia Stiehl; Ramona Eberhardt; Andreas Tünnermann

doi:10.1117/12.840495

23 February 2010 Submicron accuracy optimization for laser beam soldering processes

Erik Beckert, Thomas Burkhardt, Marcel Hornaff, Andreas Kamm, Ingo Scheidig, Cornelia Stiehl, Ramona Eberhardt, Andreas Tünnermann

Author Affiliations +

Proceedings Volume 7585, Laser-based Micro- and Nanopackaging and Assembly IV; 758505 (2010) https://doi.org/10.1117/12.840495
Event: SPIE LASE, 2010, San Francisco, California, United States

Abstract

Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of stability and functionality. Nevertheless, when packaging especially micro optical and MOEMS systems this technology has to fulfil stringent requirements for accuracy in the micron and submicron range. Investigating the assembly of several laser optical systems it has been shown that micron accuracy and submicron reproducibility can be reached when using design-of-experiment optimized solder processes that are based on applying liquid solder drops ("Solder Bumping") onto wettable metalized joining surfaces of optical components. The soldered assemblies were subject to thermal cycles and vibration/ shock test also.

Citation Download Citation

Erik Beckert, Thomas Burkhardt, Marcel Hornaff, Andreas Kamm, Ingo Scheidig, Cornelia Stiehl, Ramona Eberhardt, and Andreas Tünnermann "Submicron accuracy optimization for laser beam soldering processes", Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758505 (23 February 2010); https://doi.org/10.1117/12.840495

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