23 February 2010 Submicron accuracy optimization for laser beam soldering processes
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Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of stability and functionality. Nevertheless, when packaging especially micro optical and MOEMS systems this technology has to fulfil stringent requirements for accuracy in the micron and submicron range. Investigating the assembly of several laser optical systems it has been shown that micron accuracy and submicron reproducibility can be reached when using design-of-experiment optimized solder processes that are based on applying liquid solder drops ("Solder Bumping") onto wettable metalized joining surfaces of optical components. The soldered assemblies were subject to thermal cycles and vibration/ shock test also.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Erik Beckert, Erik Beckert, Thomas Burkhardt, Thomas Burkhardt, Marcel Hornaff, Marcel Hornaff, Andreas Kamm, Andreas Kamm, Ingo Scheidig, Ingo Scheidig, Cornelia Stiehl, Cornelia Stiehl, Ramona Eberhardt, Ramona Eberhardt, Andreas Tünnermann, Andreas Tünnermann, } "Submicron accuracy optimization for laser beam soldering processes", Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758505 (23 February 2010); doi: 10.1117/12.840495; https://doi.org/10.1117/12.840495

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