Electrode micropatterning by microcontact printing method to large area substrates using nickel mold

Atsushi Takakuwa; Takeshi Shibuya; Kiyoshi Yase

doi:10.1117/12.840588

17 February 2010 Electrode micropatterning by microcontact printing method to large area substrates using nickel mold

Atsushi Takakuwa, Takeshi Shibuya, Kiyoshi Yase

Proceedings Volume 7590, Micromachining and Microfabrication Process Technology XV; 75900N (2010) https://doi.org/10.1117/12.840588
Event: SPIE MOEMS-MEMS, 2010, San Francisco, California, United States

Abstract

Microcontact printing (μCP) was successfully used to micropattern electrodes on large area substrates. An A4-size (210 mm × 297 mm) polydimethylsiloxane (PDMS) elastomer stamp was easily fabricated using an electroformed nickel mold. The micropatterns of poly(3,4-ethylenedioxythiophene)/poly(4-stylenesulfonate) (PEDOT/PSS) and silver (Ag) thin films, which were under 10 μm in width, were fabricated by transferring the thin films on the PDMS elastomer stamp to another substrate by μCP. Bottom contact (BC) organic thin film transistors (OTFTs) with PEDOT/PSS were fabricated as source and drain electrodes. The successful operation of fabricated OTFTs with a channel length of 10 μm was demonstrated. Results show that μCP is a promising process for use with various devices that require micropatterning on large area substrates.

Citation Download Citation

Atsushi Takakuwa, Takeshi Shibuya, and Kiyoshi Yase "Electrode micropatterning by microcontact printing method to large area substrates using nickel mold", Proc. SPIE 7590, Micromachining and Microfabrication Process Technology XV, 75900N (17 February 2010); https://doi.org/10.1117/12.840588

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