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16 February 2010 Dry etching of TiO2/SiO2 DBR mirrors for tunable optical sensor arrays
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We have investigated the etching characteristics of high-index-contrast TiO2/SiO2 DBR mirrors by inductively coupled plasma reactive ion etching (ICP-RIE) with a focus on the etch rate and the etch selectivity by varying etch parameters (gas flow rate, RF and ICP power, pressure and temperature). Chrome, aluminum and ITO (indium tin oxide) were applied as etch masks. Various mixtures of SF6/Ar gas were used for the etch processes. An optimum etch profile was obtained with an etch rate of approximately 80 nm/min at a pressure of 6 mTorr and a temperature of 20 °C. The experimental results were applied to develop Fabry-Perot filters for tunable optical sensor arrays.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
O. Setyawati, M. Engenhorst, S. Wittzack, F. Köhler, C. Woidt, T. Woit, V. Daneker, M. Bartels, and H. Hillmer "Dry etching of TiO2/SiO2 DBR mirrors for tunable optical sensor arrays", Proc. SPIE 7591, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics III, 75910R (16 February 2010);

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