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Characterization of polymeric getter materials for MEMS/MOEMS and other microelectronic package service
Characterization of Au/Au, Au/Ru, and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology
Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)
Optical inspection of MOEMS devices using a configurable and suitable for production image processing system
The influence of the arrangement and spacing of CNT column array on the characteristic of field emission
Self-aligned maskless process for etching cavities in SOI wafers to enhance the quality factor of MEMS resonators
Performance and reliability assessment of a dielectric charging guard in MEMS optical switch systems