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4 February 2010 Characterization of Au/Au, Au/Ru, and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology
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Abstract
Comparisons between several pairs of contact materials have been done with a new methodology using a commercial nanoindenter coupled with electrical measurements on test vehicles specially designed to investigate the micro-scale contact physics. Experimental measurements are obtained to characterize the response of a 5 μm2 square contact bump under electromechanical stress with increased applied current. The data provide a better understanding of micro-contact behaviour related to the impact of current at low- to medium-power levels. Contact temperature rise is observed, leading to shifts of the mechanical properties of contact materials and modifications of the contact surface. The stability of the contact resistance, when the contact force increases, is studied for contact pairs of soft (Au/Au contact), harder (Ru/Ru contact) and mixed material configuration (Au/Ru contact). An enhanced stability of the bimetallic contact Au/Ru is demonstrated considering sensitivity to power increase, related to creep effects and topological modifications of the contact surfaces. These results are compared to previous ones and discussed in a theoretical way by considering the temperature distribution around the hottest area at the contact interface.
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Adrien Broue, Jérémie Dhennin, Frédéric Courtade, Christel Dieppedale, Patrick Pons, Xavier Lafontan, and Robert Plana "Characterization of Au/Au, Au/Ru, and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology", Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 75920A (4 February 2010); https://doi.org/10.1117/12.840979
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