Design and manufacture of quantum-confined punch-through SOI light sources

Alfons W. Bogalecki; Monuko du Plessis

doi:10.1117/12.842162

15 February 2010 Design and manufacture of quantum-confined punch-through SOI light sources

Alfons W. Bogalecki, Monuko du Plessis

Proceedings Volume 7605, Optoelectronic Integrated Circuits XII; 76050B (2010) https://doi.org/10.1117/12.842162
Event: SPIE OPTO, 2010, San Francisco, California, United States

Abstract

To investigate quantum-confinement (QC) effects on silicon (Si) light source electroluminescence (EL) properties like external power efficiency (EPE) and spectral emission, nanometer-scale Si finger junctions were manufactured in a fully customized silicon-on-insulator (SOI) production technology. All spectrometer-measured thickness-confined SOI light sources displayed pronounced optical power for 600 nm < λ < 1 μm. The best thickness-confined SOI light source emitted about 24 times more optical power around λ = 844 nm and exhibited an EPE improvement factor of about 21 compared to a 350 nm bulk-CMOS avalanche reference light-source operating at the same current. Internal quantum efficiency (IQE) enhancements factors of about 3.5 were attributed to carrier-confinement. The punch-through (PT) technique, which introduced breakdown voltages as low as 6 V, increased the SOI light source EPE by about a factor 2.5. It was estimated that geometric-optical improvement techniques that include Si finger surface profiling, raised the SOI light source external quantum efficiency (EQE) by about a factor 1.7. It was further shown that the SOI Si handle could be used to reflect up to about 40 % of light that would otherwise be lost due to downward radiation back up, thereby increasing the EPE of SOI light sources.

Citation Download Citation

Alfons W. Bogalecki and Monuko du Plessis "Design and manufacture of quantum-confined punch-through SOI light sources", Proc. SPIE 7605, Optoelectronic Integrated Circuits XII, 76050B (15 February 2010); https://doi.org/10.1117/12.842162

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