Optical link between FPGA microprocessors using a fiber-embedded rigid PCB

Do-Won Kim; Tae-Woo Lee; Dong-Min Im; Mu Hee Cho; Min-Hyuk Lee; Jae-Bong Choi; Hyo-Hoon Park

doi:10.1117/12.843146

23 February 2010 Optical link between FPGA microprocessors using a fiber-embedded rigid PCB

Do-Won Kim, Tae-Woo Lee, Dong-Min Im, Mu Hee Cho, Min-Hyuk Lee, Jae-Bong Choi, Hyo-Hoon Park

Proceedings Volume 7607, Optoelectronic Interconnects and Component Integration IX; 76070Q (2010) https://doi.org/10.1117/12.843146
Event: SPIE OPTO, 2010, San Francisco, California, United States

Abstract

A platform for video data link between FPGA microprocessors based on an optical printed-circuit board (OPCB) was implemented. Optimized compact size of 9.5 x 10.5 x 1.0 mm³ Tx/Rx modules were prepared and applied for the optical link of the platform. A low insertion loss of 0.42 dB and stable optical fiber-layer integrated with connectors was embedded in FR4 board for the implementation of the OPCB. The platform shows that embedding the optical fiber-layer with connectors can improve the degree of freedom for packaging as well as optical and physical characteristics. Real time video image from a charge-coupled-device (CCD) camera was successfully transmitted to a monitor through optical link between FPGA microprocessors of the platform. The captured image was successfully saved in a static random access memory (SRAM) and clearly shown on the monitor. This study shows that chip-to-chip optical interconnection technology based on fiber-layer embedded OPCB can be applied for the CPU-to-CPU/memory optical interconnections.

Citation Download Citation

Do-Won Kim, Tae-Woo Lee, Dong-Min Im, Mu Hee Cho, Min-Hyuk Lee, Jae-Bong Choi, and Hyo-Hoon Park "Optical link between FPGA microprocessors using a fiber-embedded rigid PCB", Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070Q (23 February 2010); https://doi.org/10.1117/12.843146

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