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22 January 2010 Digital-pixel focal plane array development
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Abstract
Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 μm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 μm have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Matthew G. Brown, Justin Baker, Curtis Colonero, Joe Costa, Tom Gardner, Mike Kelly, Ken Schultz, Brian Tyrrell, and Jim Wey "Digital-pixel focal plane array development", Proc. SPIE 7608, Quantum Sensing and Nanophotonic Devices VII, 76082H (22 January 2010); https://doi.org/10.1117/12.838314
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