6 February 2010 Emcore VCSEL failure mechanism and resolution
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Proceedings Volume 7615, Vertical-Cavity Surface-Emitting Lasers XIV; 761504 (2010); doi: 10.1117/12.845968
Event: SPIE OPTO, 2010, San Francisco, California, United States
Abstract
Extensive VCSEL reliability enhancements have been carried out at Emcore in the past year with significant results. In this talk, we will present the failure mechanisms, the method and effectiveness of wafer and die screening, and the approaches to eliminate these failure mechanisms. Results of improved reliability will also be discussed.
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Chun Lei, Neinyi Li, Chuan Xie, Rich Carson, Xinyu Sun, Wenlin Luo, Livia Zhao, Chris Helms, Dan Jensen, Chiyu Liu, "Emcore VCSEL failure mechanism and resolution", Proc. SPIE 7615, Vertical-Cavity Surface-Emitting Lasers XIV, 761504 (6 February 2010); doi: 10.1117/12.845968; https://doi.org/10.1117/12.845968
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KEYWORDS
Semiconducting wafers

Vertical cavity surface emitting lasers

Reliability

Failure analysis

Oxides

Process control

Wafer testing

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