12 March 2010 Novel interconnection and fabrication method for high-frequency ultrasound arrays
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Abstract
A 9-element annular array is presented that employs a newly-proposed interconnection scheme that simplifies the fabrication process. The fabricated array is a hybrid transducer structure incorporating both a piezoelectric layer and a silicon substrate in the same device. The interconnection scheme consists of a set of 9 equal area Cr/Au electrodes with a 2 mm aperture and 17 μm kerfs patterned on the surface of the silicon substrate using photolithography. A grid of Cr/Au electrodes was patterned on the surface of the piezoelectric layer, and the two layers were connected using an anisotropic conductive adhesive. To avoid the severe alignment restrictions that would result if the two electrode patterns were identical, a grid-pattern of square electrodes was substituted on the piezoelectric layer with a smaller diagonal dimension than the spaces between the silicon electrodes. A Tungsten-loaded epoxy backing layer was added to the acoustic stack and an impedance plot was measured for a single array element. Both 22 MHz and 40 MHz arrays were manufactured and the impedance plots show good correspondence with KLM modeling. A pulse-echo response was generated for the 22 MHz array, showing no degradation due to the silicon layer.
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Eric A. Simpson, Eric A. Simpson, Holly S. Lay, Holly S. Lay, Geoffrey R. Lockwood, Geoffrey R. Lockwood, } "Novel interconnection and fabrication method for high-frequency ultrasound arrays", Proc. SPIE 7629, Medical Imaging 2010: Ultrasonic Imaging, Tomography, and Therapy, 76290P (12 March 2010); doi: 10.1117/12.845383; https://doi.org/10.1117/12.845383
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