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2 December 2009 A compact electrically-pumped hybrid silicon microring laser
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Proceedings Volume 7631, Optoelectronic Materials and Devices IV; 76310Q (2009) https://doi.org/10.1117/12.850226
Event: Asia Communications and Photonics, 2009, Shanghai, Shanghai , China
Abstract
A compact electrically-pumped hybrid silicon microring laser is realized on a hybrid silicon platform. A simplified, selfaligned, deep-etch process is developed to result in low-loss resonator with a high quality factor Q>15,000. Small footprint (resonator diameter=50 μm), electrical and optical losses all contribute to lasing threshold as low as 5.4 mA and up to 65 °C operation temperature in continuous-wave (cw) mode. Outcoupling- and bus waveguide width-dependent studies are conducted for optimizing device structure. A simple qualitative study in current-voltage (IV) characteristic shows that dry etching through active region leads to <3× more leakage current at the same reverse bias than wet etch counterpart. It indicates a relatively good interface with tolerable surface recombination from deep dry etch. The spectrum is single mode with large extinction ratio (>40 dB) and small linewidth (<0.04 nm) observed. The unique bistability operation in ring resonator structure is also demonstrated.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Di Liang, Tadashi Okumura, Hsu-Hao Chang, Daryl Spencer, Ying-Hao Kuo, Alexander W. Fang, Daoxin Dai, Marco Fiorentino, Raymond G. Beausoleil, and John E. Bowers "A compact electrically-pumped hybrid silicon microring laser", Proc. SPIE 7631, Optoelectronic Materials and Devices IV, 76310Q (2 December 2009); https://doi.org/10.1117/12.850226
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