2 December 2009 Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors
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Proceedings Volume 7631, Optoelectronic Materials and Devices IV; 76311P (2009) https://doi.org/10.1117/12.852776
Event: Asia Communications and Photonics, 2009, Shanghai, Shanghai , China
Abstract
Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mmx3.3mmx2.5mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.
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Hongtao Han, Keith Main, "Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors", Proc. SPIE 7631, Optoelectronic Materials and Devices IV, 76311P (2 December 2009); doi: 10.1117/12.852776; https://doi.org/10.1117/12.852776
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