Paper
22 March 2010 Mask roughness induced LER: a rule of thumb
Brittany M. McClinton, Patrick P. Naulleau
Author Affiliations +
Abstract
Much work has already been done on how both the resist and line-edge roughness (LER) on the mask affect the final printed LER. What is poorly understood, however, is the extent to which system-level effects such as mask surface roughness, illumination conditions, and defocus couple to speckle at the image plane, and currently factor into LER limits. Here, we propose a "rule-of-thumb" simplified solution that provides a fast and powerful method to obtain mask roughness induced LER. We present modeling data on an older generation mask with a roughness of 230 pm as well as the ultimate target roughness of 50 pm. Moreover, we consider feature sizes of 50 nm and 22 nm, and show that as a function of correlation length, the LER peaks at the condition that the correlation length is approximately equal to the resolution of the imaging optic.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Brittany M. McClinton and Patrick P. Naulleau "Mask roughness induced LER: a rule of thumb", Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 76362G (22 March 2010); https://doi.org/10.1117/12.851226
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CITATIONS
Cited by 8 scholarly publications and 1 patent.
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KEYWORDS
Line edge roughness

Speckle

Photomasks

Extreme ultraviolet lithography

Statistical analysis

Extreme ultraviolet

Surface roughness

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