22 March 2010 Polycarbonate based nonchemically amplified photoresists for extreme ultraviolet lithography
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Abstract
Some initial EUVL patterning results for polycarbonate based non-chemically amplified resists are presented. Without full optimization the developer a resolution of 60 nm line spaces could be obtained. With slight overexposure (1.4 × E0) 43.5 nm lines at a half pitch of 50 nm could be printed. At 2x E0 a 28.6 nm lines at a half pitch of 50 nm could be obtained with a LER that was just above expected for mask roughness. Upon being irradiated with EUV photons, these polymers undergo chain scission with the loss of carbon dioxide and carbon monoxide. The remaining photoproducts appear to be non-volatile under standard EUV irradiation conditions, but do exhibit increased solubility in developer compared to the unirradiated polymer. The sensitivity of the polymers to EUV light is related to their oxygen content and ways to increase the sensitivity of the polymers to 10 mJ cm-2 is discussed.
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Idriss Blakey, Idriss Blakey, Anguang Yu, Anguang Yu, James Blinco, James Blinco, Kevin S. Jack, Kevin S. Jack, Heping Liu, Heping Liu, Michael Leeson, Michael Leeson, Wang Yueh, Wang Yueh, Todd Younkin, Todd Younkin, Andrew K. Whittaker, Andrew K. Whittaker, } "Polycarbonate based nonchemically amplified photoresists for extreme ultraviolet lithography", Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 763635 (22 March 2010); doi: 10.1117/12.853620; https://doi.org/10.1117/12.853620
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