Front Matter
Proc. SPIE 7637, Front Matter: Volume 7637, 763701 (19 April 2010); https://doi.org/10.1117/12.863900
Keynote Session
Proc. SPIE 7637, Maskless lithography and nanopatterning with electron and ion multibeam projection, 763703 (1 April 2010); https://doi.org/10.1117/12.852226
Nanoimprint Lithography I: UV-NIL
Proc. SPIE 7637, Step and flash imprint lithography for semiconductor high volume manufacturing?, 763706 (1 April 2010); https://doi.org/10.1117/12.846617
Proc. SPIE 7637, Planarizing material for reverse-tone step and flash imprint lithography, 763708 (3 April 2010); https://doi.org/10.1117/12.846430
Maskless Lithography I
Proc. SPIE 7637, E-beam maskless lithography: prospects and challenges, 76370A (1 April 2010); https://doi.org/10.1117/12.852229
Proc. SPIE 7637, 50 keV electron-beam projection maskless lithography (PML2): results obtained with 2,500 programmable 12.5-nm sized beams, 76370B (1 April 2010); https://doi.org/10.1117/12.846544
Proc. SPIE 7637, Evaluation of throughput improvement by MCC and CP in multicolumn e-beam exposure system, 76370C (11 March 2010); https://doi.org/10.1117/12.846464
Proc. SPIE 7637, Evaluation of maskless electron beam direct writing with double character projection apertures, 76370D (1 April 2010); https://doi.org/10.1117/12.846461
Proc. SPIE 7637, Multiple pass exposure in e-beam lithography: application to the sub-22nm nodes, 76370E (1 April 2010); https://doi.org/10.1117/12.846907
Directed Self-Assembly I: Selected Semiconductor Applications: Joint Session with Conference 7639
Proc. SPIE 7637, Self-assembling materials for lithographic patterning: overview, status, and moving forward, 76370G (1 April 2010); https://doi.org/10.1117/12.852230
Proc. SPIE 7637, Templated self-assembly of Si-containing block copolymers for nanoscale device fabrication, 76370H (30 March 2010); https://doi.org/10.1117/12.848502
Proc. SPIE 7637, CMOS process compatible directed block copolymer self-assembly for 20nm contact holes and beyond, 76370I (2 April 2010); https://doi.org/10.1117/12.848430
Directed Self-Assembly II: Processing and Functional Diversification
Proc. SPIE 7637, Directed assembly of block copolymers on lithographically defined surfaces, 76370L (1 April 2010); https://doi.org/10.1117/12.852263
Proc. SPIE 7637, Adhesion of DNA nanostructures and DNA origami to lithographically patterned self-assembled monolayers on Si[100], 76370M (2 April 2010); https://doi.org/10.1117/12.848392
Proc. SPIE 7637, Electron-beam directed materials assembly, 76370N (2 April 2010); https://doi.org/10.1117/12.846000
Proc. SPIE 7637, Self-assembling nanosphere lithography process for gated carbon nanotube field emission arrays, 76370O (2 April 2010); https://doi.org/10.1117/12.846626
Proc. SPIE 7637, Field-based simulations of directed self-assembly in a mixed brush system, 76370P (2 April 2010); https://doi.org/10.1117/12.848416
Nanoimprint Lithography II: Imprint Mask Infrastructure
Proc. SPIE 7637, Inspection of imprint lithography patterns for semiconductor and patterned media, 76370R (1 April 2010); https://doi.org/10.1117/12.848391
Proc. SPIE 7637, Fully automated hot embossing processes utilizing high resolution working stamps, 76370S (3 April 2010); https://doi.org/10.1117/12.846841
Proc. SPIE 7637, Automating molecular transfer lithography at 25nm on 200mm wafers including site-remote coating of resist on dissolvable templates, 76370U (3 April 2010); https://doi.org/10.1117/12.848402
Maskless Lithography II
Proc. SPIE 7637, Conventional and reversed image printing in electron beam direct write lithography with proximity effect corrections based on dose and shape modification, 76370W (3 April 2010); https://doi.org/10.1117/12.846514
Proc. SPIE 7637, Full-chip high resolution electron-beam lithography proximity effect correction modeling, 76370X (3 April 2010); https://doi.org/10.1117/12.846681
Novel Methods and Applications I
Proc. SPIE 7637, Biomolecular architectures and systems for nanoscience engineering, 763710 (3 April 2010); https://doi.org/10.1117/12.852266
Proc. SPIE 7637, Performance evaluation of MOSFETs with discrete dopant distribution by one-by-one doping method, 763711 (3 April 2010); https://doi.org/10.1117/12.848322
Proc. SPIE 7637, Surface electron emission lithography system based on a planar type Si nanowire array ballistic electron source, 763712 (3 April 2010); https://doi.org/10.1117/12.846343
Proc. SPIE 7637, Flying plasmonic lens at near field for high speed nanolithography, 763713 (3 April 2010); https://doi.org/10.1117/12.848370
Maskless Lithography III: Optical Maskless Lithography
Proc. SPIE 7637, Multi-shaped beam proof of lithography, 763715 (3 April 2010); https://doi.org/10.1117/12.846529
Proc. SPIE 7637, Hardware implementation of Block GC3 lossless compression algorithm for direct-write lithography systems, 763716 (3 April 2010); https://doi.org/10.1117/12.846447
Proc. SPIE 7637, Characteristics performance of production-worthy multiple e-beam maskless lithography, 763717 (3 April 2010); https://doi.org/10.1117/12.848319
Proc. SPIE 7637, Advances in DMD-based UV application reliability below 320nm, 763718 (1 April 2010); https://doi.org/10.1117/12.848461
Nanoimprint Lithography III: Selected Imprint Applications
Proc. SPIE 7637, High volume jet and flash imprint lithography for discrete track patterned media, 76371A (3 April 2010); https://doi.org/10.1117/12.849226
Novel Methods and Applications II
Proc. SPIE 7637, Tip-based nanofabrication: an approach to true nanotechnology, 76371D (3 April 2010); https://doi.org/10.1117/12.852269
Proc. SPIE 7637, Direct write 3-dimensional nanopatterning using probes, 76371E (3 April 2010); https://doi.org/10.1117/12.847290
Proc. SPIE 7637, High throughput plasmonic lithography for sub 50nm patterning with a contact probe, 76371F (3 April 2010); https://doi.org/10.1117/12.848329
Proc. SPIE 7637, Maskless plasmonic lithography for patterning of one- and two-dimensional periodic features, 76371G (3 April 2010); https://doi.org/10.1117/12.847981
Cross-Cutting Technologies
Proc. SPIE 7637, SLICE image analysis for diblock copolymer characterization and process optimization, 76371J (3 April 2010); https://doi.org/10.1117/12.848378
Proc. SPIE 7637, Monitor and self-diagnostic technology for mask e-beam writing system, 76371K (3 April 2010); https://doi.org/10.1117/12.846266
Proc. SPIE 7637, Lossless compression algorithm for REBL direct-write e-beam lithography system, 76371L (3 April 2010); https://doi.org/10.1117/12.845506
Poster Session
Proc. SPIE 7637, Full area pattern decomposition of self-aligned double patterning for 30nm node NAND FLASH process, 76371N (3 April 2010); https://doi.org/10.1117/12.845831
Proc. SPIE 7637, A novel lithography process for 3D (three-dimensional) interconnect using an optical direct-writing exposure system, 76371O (3 April 2010); https://doi.org/10.1117/12.846013
Proc. SPIE 7637, Architecture for next-generation massively parallel maskless lithography system (MPML2), 76371Q (3 April 2010); https://doi.org/10.1117/12.846444
Proc. SPIE 7637, Nanoimprint template fabrication using wafer pattern for sub-30nm, 76371R (3 April 2010); https://doi.org/10.1117/12.846481
Proc. SPIE 7637, CP based EBDW throughput enhancement for 22nm high volume manufacturing, 76371S (3 April 2010); https://doi.org/10.1117/12.846492
Proc. SPIE 7637, Monte Carlo modeling of BSE reflection in e-beam writers, 76371T (3 April 2010); https://doi.org/10.1117/12.846517
Proc. SPIE 7637, Investigation of lithographic feature characteristics using UV cure as a pitch doubling stabilization technology for the 32nm node and beyond, 76371U (3 April 2010); https://doi.org/10.1117/12.846624
Proc. SPIE 7637, Model-based proximity effect correction for electron-beam direct-write lithography, 76371V (3 April 2010); https://doi.org/10.1117/12.846706
Proc. SPIE 7637, High volume manufacturing of nanoimprint lithography produced devices: addressing the stamp supply challenge, 76371X (3 April 2010); https://doi.org/10.1117/12.848332
Proc. SPIE 7637, Operation and performance of the CNSE Vistec VB300 electron beam lithography system, 76371Y (3 April 2010); https://doi.org/10.1117/12.848396
Proc. SPIE 7637, Throughput enhancement technique for MAPPER maskless lithography, 76371Z (3 April 2010); https://doi.org/10.1117/12.849447
Proc. SPIE 7637, Design and fabrication of Si-based photonic crystal stamps with electron beam lithography (EBL), 763720 (3 April 2010); https://doi.org/10.1117/12.848266
Proc. SPIE 7637, A first order analysis of scatterometry sensitivity for NIL process, 763721 (3 April 2010); https://doi.org/10.1117/12.855872