Preliminary results for photomask haze mitigation in a fab environment

Thomas Ku; Jeff LeClaire; Sia Kim Tan; Gek Soon Chua; Ron Bozak; Roy White; Tod Robinson; Michael Archuletta; David Lee

doi:10.1117/12.848283

1 April 2010 Preliminary results for photomask haze mitigation in a fab environment

Thomas Ku, Jeff LeClaire, Sia Kim Tan, Gek Soon Chua, Ron Bozak, Roy White, Tod Robinson, Michael Archuletta, David Lee

Proceedings Volume 7638, Metrology, Inspection, and Process Control for Microlithography XXIV; 763817 (2010) https://doi.org/10.1117/12.848283
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

A persistent industry problem impacting photomask yield and costs has been haze formation. The haze nucleation and growth phenomenon on critical photomask surfaces has periodically gained attention as it has significantly impacted wafer printability for different technology nodes over the years. A number of process solutions have been promoted in the semiconductor industry which has been shown to suppress or minimize the propensity for haze formation, but none of these technologies can stop every instance of haze. Thus some capability will always be needed to remove haze on photomasks with their final pellicles mounted both at the manufacture and long term maintenance stages of a mask's lifetime. A novel technology is reviewed here which uses a dry (no chemical effluents) removal system to sweep the entire printable region of a pelliclized photomask to eliminate all removable haze regardless of the mask substrate materials or the presence of critical patterns. An operational process technique for this system and performance in removal is shown for haze located on the mask pattern surface. Finally, preliminary data from tool acceptance and preliminary use in a production environment will also be reviewed.

Citation Download Citation

Thomas Ku, Jeff LeClaire, Sia Kim Tan, Gek Soon Chua, Ron Bozak, Roy White, Tod Robinson, Michael Archuletta, and David Lee "Preliminary results for photomask haze mitigation in a fab environment", Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 763817 (1 April 2010); https://doi.org/10.1117/12.848283

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available