15 April 2010 Product and tool control using integrated auto macro defect inspection in the photolithography cluster
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Abstract
Defectivity control continues to challenge advanced semiconductor manufacturing, especially immersion lithography processes. Immersion exposure tools are sensitive to incoming wafer defects, including top coat voids, surface defects, and other random or systematic anomalies. A single defective wafer could contaminate the exposure tool's immersion hood resulting in lengthy and costly repairs. To mitigate this problem, TEL developed an integrated and real-time macro inspection solution to identify defective wafers which could potentially damage immersion exposure tools. The Wafer Intelligent Scanner (WIS) module integrates within the CLEAN TRACKTM LITHIUS ProTM platform without impacting footprint or throughput. By utilizing user defined inspection criteria, wafers can be inspected prior to and after exposure for macro defects. Wafers failing to meet inspection criteria prior to exposure are automatically re-routed to bypass the exposure tool and subsequent process modules.
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Ted L. Taylor, Paul Shirley, David Dixon, Shoichiro Yanagi, Eri Makimura, "Product and tool control using integrated auto macro defect inspection in the photolithography cluster", Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 763821 (15 April 2010); doi: 10.1117/12.846571; https://doi.org/10.1117/12.846571
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