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Fabrication of dual damascene BEOL structures using a multilevel multiple exposure (MLME) scheme, part 1: lithographic patterning
Negative-tone chemically amplified molecular resist based on novel fullerene derivative for nanolithography
Non-chemically amplified resists for 193-nm immersion lithography: influence of absorbance on performance
Fabrication of dual damascene BEOL structures using a multilevel multiple exposure (MLME) scheme, part 2: RIE-based pattern transfer and completion of dual damascene process yielding an electrically functional via chain
Thin film buckling as a method to explore the effect of reactive rinse treatments on the mechanical properties of resist thin films
Dynamics of radical cation of poly(4-hydroxystyrene) generated in thin film upon exposure to electron beam