Improved thermal flow characteristic resist optimized for the manufacturing of microlenses

Medhat A. Toukhy; Margareta Puanescu; Stephen Meyer

doi:10.1117/12.848250

29 March 2010 Improved thermal flow characteristic resist optimized for the manufacturing of microlenses

Medhat A. Toukhy, Margareta Puanescu, Stephen Meyer

Proceedings Volume 7639, Advances in Resist Materials and Processing Technology XXVII; 763911 (2010) https://doi.org/10.1117/12.848250
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

A newly developed chemically amplified (CA) i-line positive resist is designed to reflow the resist structures at relatively low temperatures while eliminating thermal crosslinking mechanisms. The resist can reflow to form clear spherical lenses having greater than 90° contact angles. This is demonstrated by thermally reflowing squared resist posts, 50μm and 80μm in size printed in 48μm resist thickness and 10μm posts in 15μm thickness at 120°C. The resulting lenses have smooth surfaces, free of any wrinkling or residual resist corners.

Citation Download Citation

Medhat A. Toukhy, Margareta Puanescu, and Stephen Meyer "Improved thermal flow characteristic resist optimized for the manufacturing of microlenses", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763911 (29 March 2010); https://doi.org/10.1117/12.848250

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